Thermal Characterization of an LTCC Module for Miniature Atomic Clock Packaging
نویسندگان
چکیده
منابع مشابه
Thermal Characterization of an LTCC Module for Miniature Atomic Clock Packaging
This paper presents the thermal characterization of an LTCC module dedicated for the packaging of a miniature atomic clock. An LTCC device of dimensions of 15 × 22 mm has been designed for the packaging of the elements of a miniature atomic clock. This module acts as a carrier for the components of the clock as well as temperature controller; this is particularly attractive since each component...
متن کاملEffects of Thermal Losses on the Heating of a Multifunctional LTCC Module for Atomic Clock Packaging
An innovative multifunctional LTCC module has been designed for miniature atomic clock packaging. The components of miniature atomic clocks need to be efficiently packaged and connected to each other, and a precise temperature control is required for them. The great advantage of using LTCC technology for this application is that it allows the integration of different functions, such as heaters ...
متن کاملThermal Assessment of RF Integrated LTCC Front End Module (FEM)
The thermal performance of Front End Module (FEM) incorporating Low Temperature Co-fired Ceramic (LTCC) substrate is investigated. An Infrared Microscope System was used to measure device surface temperature with both RF and DC power at various duty cycles (25 to 100%). The maximum junction temperature (~112°C) occurs at the second stage. By powering the module with DC only, the comparison betw...
متن کاملLTCC Module Computational Methods
∆u = ∂2u ∂x1 + ∂2u ∂x2 where x = (x1, x2) ∈ IR 2 are Cartesian coordinates. Even though the Poisson equation looks very special it is an important model case representing several problems from physics based on energy minimisation. Variations of the techniques we will study apply to a wide class of second order so-called elliptic problems. It is known that there are cases where no classical (i.e...
متن کاملA Compact LTCC Bluetooth System Module with an Integrated Antenna
In this article, a system-on-package (SoP) approach for Bluetooth system module applications using low-temperature co-fired ceramic (LTCC) technology is presented. The developed LTCC integrated substrate for our Bluetooth module application is overall 12 12 1 mm in size, with integration of two originally proposed components, a balanced-to-unbalanced bandpass filter and a folded meander-line in...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
سال: 2012
ISSN: 2380-4491
DOI: 10.4071/cicmt-2012-wp21